Мерење ратних места

Digital holography measures PCB warpage in real-time during reflow. In-line systems detect >0.1% deformation at 5μm accuracy. Warpage causes: CTE mismatch, moisture absorption. Mitigation: Balanced copper distribution, low-CTE laminates. IPC-9641 defines acceptance criteria. Dynamic warpage compensation algorithms adjust pallet vacuum zones. Critical for large BGAs (>45 мм) у плочима сервера .